Aperture Sectors › AI Hardware & Chips › Chip manufacturing & materials
Chip manufacturing & materials funding
Chip manufacturing & materials
A sub-sector of AI Hardware & Chips. Each company counts once, in its main sub-sector.
19 rounds, $467M raised by 18 companies, Jan 2, 2023 to Nov 14, 2026, 1% of AI Hardware & Chips capital. Top three companies: Xin'ai Technology (芯爱科技) 48%, xLight 9%, GSME 7%.
| Company | HQ | Capital raised | Rounds | Exit |
|---|---|---|---|---|
| Xin'ai Technology (芯爱科技) | China | $225M | 1 | — |
| xLight | United States | $40M | 1 | — |
| GSME | United States | $35M | 1 | — |
| Huanjingxin Technology | China | $30M | 1 | — |
| Galatek.ai | Singapore | $30M | 1 | — |
| unnamed AI chip printing startup | Australia | $26M | 2 | — |
| Thintronics | United States | $23M | 1 | — |
| Zhongjia Micro-view | China | $14M | 1 | — |
| Omnitron Sensors | United States | $13M | 1 | — |
| Nexstrom | Singapore | $12M | 1 | — |
| Vertical Semiconductor | United States | $11M | 1 | — |
| SixSense | Singapore | $8.5M | 1 | — |
| TRUTH INSTRUMENTS (致真精密仪器) | China | $0 | 1 | — |
| Jiuwei Photonics (九维光子) | China | $0 | 1 | — |
| Invisix | Netherlands | $0 | 1 | — |
| SemiAI | South Korea | $0 | 1 | — |
| Hanchi Technology | China | $0 | 1 | — |
| Ephos | Italy | $0 | 1 | — |
| Company | Amount | Stage | Announced |
|---|---|---|---|
| Xin'ai Technology (芯爱科技) | $225M | Series A | Oct 19, 2026 |
| xLight | $40M | Series B | Jul 22, 2025 |
| GSME | $35M | Series B | Jan 6, 2026 |
| Huanjingxin Technology | $30M | Seed | Apr 19, 2026 |
| Galatek.ai | $30M | Series A | Dec 19, 2025 |
| unnamed AI chip printing startup | $26M | Series A | Apr 21, 2026 |
| Thintronics | $23M | Series A | Apr 30, 2024 |
| Zhongjia Micro-view | $14M | Series A | Jul 10, 2025 |
| Omnitron Sensors | $13M | Series A | Jan 30, 2025 |
| Nexstrom | $12M | Seed | Sep 22, 2026 |