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Interconnect & memory funding

Interconnect & memory

A sub-sector of AI Hardware & Chips. Each company counts once, in its main sub-sector.

100 rounds, $8.7B raised by 67 companies, Jan 2, 2023 to Nov 14, 2026, 26% of AI Hardware & Chips capital. Top three companies: Ayar Labs 10%, Lightmatter 8%, Lumilens 8%.

Companies by capital raised
CompanyHQCapital raisedRoundsExit
Ayar LabsUnited States$830M4—
LightmatterUnited States$709M3—
LumilensUnited States$700M1—
Nexthop AIUnited States$610M2—
Celestial AIUnited States$525M4Acquired
Upscale AIUnited States$490M3—
Celero CommunicationsUnited States$375M3—
Silicon BoxSingapore$350M2—
AGIC micro (谦合益邦)China$297M1—
Velaura AIUnited States$263M2—
EnfabricaUnited States$240M2Talent deal
Kandou AIUnited States$225M1—
EliyanUnited States$205M2—
EriduUnited States$200M1—
MetisX (now XCENA)South Korea$179M2—
Point2 TechnologyUnited States$159M2—
Salience LabsUnited Kingdom$155M2—
CScaleUnited States$145M1—
nEye SystemsUnited States$138M2—
AttoTudeUnited States$131M3—
Aria NetworksUnited States$125M1—
Delos DataUnited States$100M1—
EnCharge AIUnited States$100M1—
VolantisUnited States$97M2—
Mojo VisionUnited States$92M2—
The ten largest rounds
CompanyAmountStageAnnounced
Lumilens$700MUnlabeledAug 7, 2026
Nexthop AI$500MSeries BMar 10, 2026
Ayar Labs$500MSeries EMar 3, 2026
Lightmatter$400MSeries DOct 16, 2024
AGIC micro (谦合益邦)$297MSeries BAug 14, 2026
Celero Communications$275MSeries CSep 8, 2026
Celestial AI$250MSeries CMar 11, 2025
Kandou AI$225MSeries AApr 4, 2026
Eridu$200MSeries AMar 1, 2026
Upscale AI$200MSeries AJan 21, 2026