Sectors › Robotics & Physical AI › Components, hands & sensors
Components, hands & sensors funding
Components, hands & sensors
A sub-sector of Robotics & Physical AI. Each company counts once, in its main sub-sector.
91 rounds, $898M raised by 60 companies, Jan 2, 2023 to Nov 14, 2026, 1% of Robotics & Physical AI capital. Top three companies: Linkerbot (灵心巧手) 26%, PaXini Tech 18%, OriginFlow (渊澈太初) 8%.
| Company | HQ | Capital raised | Rounds | Exit |
|---|---|---|---|---|
| Linkerbot (灵心巧手) | China | $231M | 7 | — |
| PaXini Tech | China | $162M | 6 | — |
| OriginFlow (渊澈太初) | China | $74M | 1 | — |
| Tacta Systems | United States | $64M | 1 | — |
| RealSense | United States | $50M | 1 | — |
| Linghou Robotics | China | $43M | 6 | — |
| Motorevo | China | $30M | 1 | — |
| 意优科技 | China | $30M | 1 | — |
| OYMotion Technologies | China | $22M | 2 | — |
| MoSense (模感科技) | China | $15M | 2 | — |
| HYFIX Spatial Intelligence | United States | $15M | 1 | — |
| YITA Dynamics | China | $15M | 1 | — |
| Yuansheng Xianda Technology | China | $15M | 2 | — |
| 诺仕机器人 (NOUSBOT) | China | $15M | 1 | — |
| Singularity Intelligent Control (奇点智控(上海)科技有限公司) | China | $15M | 1 | — |
| 橡木果机器人(Acorn Robot) | China | $15M | 1 | — |
| Zhibo Quan | China | $14M | 3 | — |
| Interstellar Light-year (Xingji Guangnian) | China | $14M | 1 | — |
| FLEXOO | Germany | $13M | 1 | — |
| Haply Robotics | Canada | $12M | 1 | — |
| Proception | United States | $11M | 1 | — |
| Quanzhibo | China | $5M | 1 | — |
| Tesollo | South Korea | $4.4M | 2 | — |
| AILOS Robotics | Belgium | $4.1M | 1 | — |
| AdapTronics | Italy | $3.6M | 1 | — |
| Company | Amount | Stage | Announced |
|---|---|---|---|
| Linkerbot (灵心巧手) | $217M | Series B | Feb 12, 2026 |
| PaXini Tech | $148M | Unlabeled | Aug 3, 2026 |
| OriginFlow (渊澈太初) | $74M | Pre-A | May 21, 2026 |
| Tacta Systems | $64M | Series A | Jun 26, 2025 |
| RealSense | $50M | Series A | Jul 11, 2025 |
| Motorevo | $30M | Series A | Apr 22, 2026 |
| 意优科技 | $30M | Series B | Aug 13, 2026 |
| OYMotion Technologies | $22M | Series C | Mar 26, 2026 |
| MoSense (模感科技) | $15M | Seed | Oct 26, 2026 |
| HYFIX Spatial Intelligence | $15M | Seed | Apr 15, 2026 |